Senior Staff Package Definition Engineer - Semiconductor Innovation
Infineon Technologies ยท ๐ Denpasar, Bali, Indonesia ยท Diposting 2026-10-09
FULL_TIMEโญ TERVERIFIKASI
IDR 800000000 - 1200000000
Infineon Technologies is seeking a highly skilled and experienced Senior Staff Package Definition Engineer to join our team in Denpasar, Bali. This role is pivotal in driving our semiconductor innovation initiatives. The ideal candidate will have a strong background in package design and development, with a proven track record of leading complex projects to successful completion. This is an exciting opportunity to be part of a global leader in semiconductor technology.๐ Tanggung Jawab Pekerjaan
Lead the development of advanced semiconductor packages, ensuring high performance and reliability.,Collaborate with cross-functional teams to define and implement package design specifications.,Conduct feasibility studies and provide technical guidance on package design challenges.,Oversee the development of new packaging technologies and materials.,Ensure compliance with industry standards and Infineon's quality and safety regulations.,Mentor and develop junior engineers, fostering a culture of continuous learning and improvement.,Participate in project reviews and decision-making processes to drive innovation in package design.,Manage and optimize package design processes to enhance efficiency and reduce costs.๐ Kualifikasi & Syarat
Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.,Minimum of 10 years of experience in package design and development, with a strong focus on semiconductor technology.,Proven track record of leading and delivering complex package design projects.,In-depth knowledge of semiconductor packaging technologies, including wafer-level packaging, system-in-package, and 3D packaging.,Strong understanding of industry standards and regulations relevant to semiconductor packaging.,Excellent problem-solving skills and the ability to think creatively to overcome technical challenges.,Proficient in using industry-standard design tools and software.,Strong leadership and communication skills, with the ability to influence and collaborate effectively with cross-functional teams.๐ ๏ธ Keahlian
Semiconductor packaging technologiesAdvanced package design and developmentFeasibility studies and technical guidanceProject management and leadershipIndustry standards and regulationsProblem-solving and innovationDesign tools and software proficiencyEffective communication and collaboration
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